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Backside Wafer Damage Induced Wafer Front Side Defect and Yield Impact

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4 Author(s)
Neng-Cheng Wang ; ProMOS Technol. Inc. Production Technol. Div., Hsinchu ; Hui-An Chang ; Chang, C.-I. ; Wang, T.

The article describes the wafer yield loss due to wafer backside defect. The backside defect pattern will transfer to the next wafer surface during the following clean process and cause the process defect issue. These defects will impact the yield. Real root cause finding let prevent action work well.

Published in:

Advanced Semiconductor Manufacturing Conference, 2007. ASMC 2007. IEEE/SEMI

Date of Conference:

11-12 June 2007

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