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Linking Geometrical and Electrical Parameters of Flex Substrate Vertical Interconnects for 2.5D System-in-Package Design

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7 Author(s)
Maass, U. ; Fraunhofer Inst. for Reliability & Microintegration, Berlin ; Polityko, D.D. ; Richter, C. ; Ndip, I.
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Flexible substrate are gaining more and more in importance in different electronics area. One of the methods to achieve vertical integration within system-in-package (SiP) approach is folding of substrates. The behavior of the folded segments, which are acting as vertical interconnects will be discussed in this paper from geometrical and electrical point of view.

Published in:
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th

Date of Conference: May 29 2007-June 1 2007

Page(s):
1861 - 1865
ISSN :
0569-5503
E-ISBN :
1-4244-0985-3
Print ISBN:
1-4244-0985-3
INSPEC Accession Number:
9717850
Conference Location :
Reno, NV
Digital Object Identifier :
10.1109/ECTC.2007.374051
Product Type:
Conference Publications

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