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Thin-Film Fine-Pattern Technology for LTCC Multilayer Substrates

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4 Author(s)
Brian Anderson ; Koa Speer Electronics, Inc., Bolivar Drive, PO Box 547, Bradford, PA 16701 USA. +1 814 362 5536, ; Shuichi Horio ; Kyoji Kobayashi ; Nobuhiko Tamada

The ability to create fine-pattern line widths on LTCC technology substrates, which can be used for high-temperature and high-frequency applications, has been restricted by the limitations of the existing thick-film technology to a practical level of approximately 60 mum line widths; other technologies for finer line widths and spacings are, as yet, experimental in nature. In this study, the use of a thin-film process, which is already used in the mass production of electronic components, is evaluated for use as a fine surface-layer pattern in line widths as small as 15 mum. Such a technology is possible and appropriate when due attention is paid to the chemistry of the process, the use of low-halogen insulation materials, the use of uniform processes, and appropriate washing methods.

Published in:

2007 Proceedings 57th Electronic Components and Technology Conference

Date of Conference:

May 29 2007-June 1 2007