By Topic

Thin-Film Fine-Pattern Technology for LTCC Multilayer Substrates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Anderson, B. ; Koa Speer Electron., Bradford ; Horio, S. ; Kobayashi, K. ; Tamada, N.

The ability to create fine-pattern line widths on LTCC technology substrates, which can be used for high-temperature and high-frequency applications, has been restricted by the limitations of the existing thick-film technology to a practical level of approximately 60 mum line widths; other technologies for finer line widths and spacings are, as yet, experimental in nature. In this study, the use of a thin-film process, which is already used in the mass production of electronic components, is evaluated for use as a fine surface-layer pattern in line widths as small as 15 mum. Such a technology is possible and appropriate when due attention is paid to the chemistry of the process, the use of low-halogen insulation materials, the use of uniform processes, and appropriate washing methods.

Published in:

Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th

Date of Conference:

May 29 2007-June 1 2007