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57th Electronic Components & Technology Conference

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The following topics are dealt with: flip chips; IC interconnections; board level reliability; thermal mechanical loading; radiofrequency components; lead free materials; 3D packaging; copper low k; embedded devices; nanotechnology; advanced substrates; shock vibrations; creep; wafer level packaging; silicon interconnect; solder; microoptical component packaging; radiofrequency modules; polymer composites; MEMS packaging; optical interconnects; system in packaging; package on package; chip scale packaging; bump reliability; electromigration; bioelectronics; flexible electronics.

Published in:

Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th

Date of Conference:

May 29 2007-June 1 2007