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Bond integrity evaluation using transmission scanning acoustic microscopy

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2 Author(s)
Sinclair, D.A. ; University College London, Department of Electronic & Electrical Engineering, London, UK ; Ash, E.A.

Low frequency transmission scanning acoustic microscopy is capable of revealing voids and delaminations at substantial depths inside a solid material. The technique is demonstrated with reference to the bond between a carbon diamond compound sintered to a steel base. A resolution comparable to the wavelength inside the solid material is achieved.

Published in:

Electronics Letters  (Volume:16 ,  Issue: 23 )

Date of Publication:

November 6 1980

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