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Analyses of electromagnetic scattering from wire-mesh structures

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2 Author(s)
Hill, D.A. ; US Department of Commerce, Office of Telecommunications, Institute for Telecommunication Sciences, Boulder, USA ; Wait, J.R.

Various analytical and numerical methods have been developed recently to calculate the interaction of wire-mesh structures with electromagnetic waves. An intercomparison of these methods is reported for the two cases where the wire junctions are bonded and unbonded. In particular, it is found that the average boundary condition method of Kontorovich and Astrakhan appears to give valid results only if the interwire spacing of the mesh is small compared with a wavelength. However, we may safely conclude from both their work and ours that bonding the wire junctions may degrade the shielding performance of such meshes.

Published in:

Electronics Letters  (Volume:12 ,  Issue: 17 )