By Topic

SiGe BiCMOS Technology: An IC Design Platform for Extreme Environment Electronics Applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Cressler, J.D. ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA

The drivers in the extreme environment electronics community are beginning to perk up their ears to the possibilities of using SiGe technology, especially for space electronics applications. The present NASA-funded project, "SiGe integrated electronics for extreme environments," which is aimed at enabling more effective lunar exploration, represents a 'first' of sorts - a chance to develop the requisite SiGe infrastructure; from technology, to characterization tools, to modeling, to circuit design, to packaging, to reliability, to functional sub-systems, needed to support the development and eventual insertion of SiGe into emerging extreme environment venues. The authors are excited about our progress, and firmly believe that the greater electronics community can and should leverage this effort for a wide variety of their applications. Ensuring adequate reliability for SiGe technologies in these new application venues will require more effort from the reliability community. Initial results look very promising indeed.

Published in:

Reliability physics symposium, 2007. proceedings. 45th annual. ieee international

Date of Conference:

15-19 April 2007