By Topic

High-performance vertical transition for broadband and millimetre-wave BGA module packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Kangasvieri, T. ; Microelectron. & Mater. Phys. Labs., Univ. of Oulu, Oulu ; Halme, J. ; Vahakangas, J. ; Lahti, M.

A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated. Measured results agreed well with full- wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.

Published in:

Electronics Letters  (Volume:43 ,  Issue: 11 )