Cart (Loading....) | Create Account
Close category search window
 

Experimental Observation of Halo-Type Boundary Image Sticking in AC Plasma Display Panel

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)

Infrared-emission observations show that the discharge characteristics related to the MgO surface are improved in both the image sticking and boundary image sticking cells, whereas luminance observations show a deterioration in the visible-conversion characteristics related to the phosphor layer in both the image sticking and boundary image sticking cells. Consequently, the image sticking phenomenon is strongly related to the Mg species sputtered from the MgO surface of the discharge cells due to an iterant strong sustain discharge. In particular, halo-type boundary image sticking is due to the redeposition of Mg species on both the MgO and phosphor layers in the nondischarge region adjacent to the discharge region, as confirmed by Vt close curve, time-of-flight secondary ion mass spectrometry, and scanning electron microscope analyses.

Published in:

Electron Devices, IEEE Transactions on  (Volume:54 ,  Issue: 6 )

Date of Publication:

June 2007

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.