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Challenges in Modification of Electronic Components

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1 Author(s)
Russell T. Winslow ; Six Sigma, Milpitas, CA

Due to the surge in commercial applications, the semiconductor industry is literally brushing off their low-volume customers, including the military and aerospace industry. Recent conversions of components to pure tin (Sn) and other Pb-free finishes and materials have dramatically increased the complexity for these specialized modification services. These increased complexities in hot solder dip (HSD) and ball grid array (BGA) reballing are discussed in this open forum article. The author addresses the driving forces and why it is necessary to modify some commercial-off-the-shelf (COTS) components. Then he presents two specific component level modifications with some details: HSD and BGA reballing. With each of the conversions, some of the complexities faced by service providers are presented. Some suggestions on navigating the quagmire of new package designs and material changes being thrust upon the military and aerospace community are also discussed. Finally, the author concludes with some suggestions on how the industry can deal with these complexities and move carefully forward

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:30 ,  Issue: 2 )