By Topic

Hierarchically Nested Channels for Fast Squeezing Interfaces With Reduced Thermal Resistance

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)

We report on a simple method to improve bondline formation kinetics by means of a hierarchical set of channels patterned into one of the surfaces. The channel arrays are used to improve the gap squeezing and cooling of single and multiple flip-chip electronic modules with highly viscous fluids and thermal pastes or greases. They allow a fast formation of thin gaps or bond lines by reducing the pressure gradient in the thermal interface material as it moves in and out of the gap. Models describing the dynamics of Newtonian fluids in these "hierarchically nested channel" interfaces combine squeeze flow and Hagen-Poiseuille theories. Rapid bond-line formation is demonstrated for Newtonian fluids and selected particle-filled pastes. Modeling of particle-laden polymeric pastes includes Bingham and Hershel-Bulkley fluid properties. Bond-line formation and thermal resistance are improved particularly for high-viscosity high-thermal-conductivity interface materials created from higher-volumetric particle loadings or for thermal interface materials with smaller filler-particle diameters

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:30 ,  Issue: 2 )