By Topic

Minimum-Congestion Placement for Y-interconnects: Some studies and observations

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Tuhina Samantam ; Bengal Eng. & Sci. Univ., Howrah ; Ghosal, P. ; Rahaman, H. ; Dasgupta, P.

Y-interconnects for VLSI chips are based on the use of global and semi-global wiring in only 0deg, 60deg, and 120deg. Though X-interconnects are fast replacing the traditional Manhattan (M) interconnects, the very recently proposed Y-interconnects have been observed to possess certain key advantages, Y-interconnects tend to consume less routing resources than M-interconnects. Unlike the X-interconnect architectures, Y-interconnect architectures support regular routing grid. This is indeed very important for simplifying manufacturing processes and applying the routing and design rule checking algorithms. Several efficient Y-routing algorithms have been proposed in literature. However, to the best of our knowledge, not much have been reported so far in designing algorithms for Y-interconnect-based VLSI module placement and its effects on the congestion or wire-lengths. In this paper, in an attempt to fill the gap in the existing literature, we propose a novel simulated-annealing-based placement technique for mixed-sized cells which tries to reduce the congestion for Y-interconnects. The proposed method attempts to reduce the congestion, and observes the corresponding changes in the estimated lengths of the Y-interconnects. It has been implemented in Linux environment and experiments performed with randomly generated instances, and some well-known benchmarks. The wirelength estimates for the Y-interconnects, and Manhattan interconnects for the same placement instances are compared. Results obtained are quite encouraging. The experimental results for a specific number of iterations and cooling schedule show improvements in congestion in most of the cases

Published in:

VLSI, 2007. ISVLSI '07. IEEE Computer Society Annual Symposium on

Date of Conference:

9-11 March 2007