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Improvement of Moisture Resistance by Ion-Exchange Process

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3 Author(s)
Mizugashira, S. ; Quality Laboratory, Semiconductor Group, Matsushita Electronics Corporation, 1, Kotari Yake-machi, Nagaokakyo, Kyoto, Japan (617) Tel. 075-951-8151 ; Higuchi, H. ; Ajiki, T.

To improve the moisture resistance after soldering heat stress for SMD(Surface Mount Device), a new approach introducing the "Ion-exchange process" was succesfully tried out. In this approach, ion-exchanging material(usually called "ion-trap") is added to the molding compound substituting the highly active impurity+ ions+ in the compound by weak ones(ex. Cl- ¿ OH-, Na+ ¿ H+). By applying this process, the lifetime for both cathodic and Al pad corrosion becomes 1.5~3 times longer for the epoxy compounds tested.

Published in:

Reliability Physics Symposium, 1987. 25th Annual

Date of Conference:

April 1987