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"Silver Plated Lead Frames" for Large Molded Packages

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2 Author(s)
Paul Flaskerud ; Electronic Arrays, Inc., Mountain View, California ; Rick Mann

The use of gold in integrated circuit packages has become prohibitive because of cost. Of the current alternatives available, silver plating offers a favorable economic advantage to the MOS-LSI manufacturer. This paper discusses the economics of various gold substitute systems. In addition, the paper presents data which demonstrates the reliability of molded packages using silver plated lead frames. Reliability data on Life, Temperature Cycling, 85°C/85% R.H. and Solderability Testing is presented. Silver plating is an economical and reliable system for use in molded packages for MOS-LSI devices.

Published in:

Reliability Physics Symposium, 1974. 12th Annual

Date of Conference:

April 1974