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High-Reliability Plastic Package for Integrated Circuits

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1 Author(s)
H. Khajezadeh ; Manager, Linear IC Product Development, RCA Solid State, Somerville, N.J., 08876

Two orders of magnitude improvement in the reliability of plastic packages has been achieved as the result of a systematic study of basic failure mechanisms and the development of improved materials, handling procedures and process controls. This improved integrated-circuit packaging system has resulted in plastic-encapsulated product capable of matching the reliability of hermetic packages under severe environmental stress.

Published in:

Reliability Physics Symposium, 1973. 11th Annual

Date of Conference:

April 1973