Cart (Loading....) | Create Account
Close category search window
 

Domain Wall Pinning and Corresponding Energy Barrier in Percolated Perpendicular Medium

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Yuhui Tang ; Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA ; Zhu, Jian-Gang

The domain wall pinning processes in a percolated perpendicular medium are studied using micromagnetic modeling. With a given nonmagnetic pinning site, the energy barrier of the pinned domain wall reaches a maximum when the domain wall width is about twice the size of the pinning site. For transitions in the percolated perpendicular medium, the energy barrier for the transition shift is sensitive to the pinning site spacing. Considering regularly distributed pinning sites with 4.7-nm center-to-center spacing, the energy barrier for the transition shift is about twice the energy barrier of the domain wall pinned by one pinning site. The domain stability in percolated perpendicular medium is also discussed with an analytic model

Published in:

Magnetics, IEEE Transactions on  (Volume:43 ,  Issue: 6 )

Date of Publication:

June 2007

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.