By Topic

Thermal Simulation with Coupled Network Models on System Level

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Augustin, A. ; Freescale Semicond., Munich ; Maj, B.

The paper describes thermal modeling with coupled network models by means of a typical optimization process for semiconductor products. This becomes especially important in automotive applications with small thermal budgets. Using two different module configurations, the entire modeling process is discussed in detail. The approach with boundary condition independent compact models provides a much faster simulation, enabling execution of thermal case studies for different mechanical designs, considering diversity of transient loading conditions.

Published in:

Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on

Date of Conference:

16-18 April 2007