By Topic

Computational Design and Optimisation of Mechanically Reinforced Masks for Stencil Lithography

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Maryna Lishchynska ; Tyndall National Institute, Cork, Ireland. email: ; Marc A. F. van den Boogaart ; Juergen Brugger ; James C. Greer

Identifying, predicting and optimising stencil lithography is critical to the successful and timely development of this technique with a wide range of potential applications such as deposition on non- conventional and unstable materials (i.e. bio-chemical, hydrophobic), patterning heterostructures (epitaxial, magnetic, complex oxides, piezoelectric materials) and deposition of nanodevices onto CMOS. Previously confirmed for cantilever-like stencils is the thesis that degrading effects of stress-induced deformation of stencils can be overcome by strategic placement of corrugating structures. This approach is further exploited in this work to mechanically stabilise complex stencil designs. This involved studying the evolution of stencil deformation due to deposition induced stress and iterative design of optimal corrugation structures to be incorporated into the stencils. It is shown that degrading effects of stress-induced deformation of stencils can be significantly reduced which subsequently improves pattern definition. Reduction in deformation and in pattern distortion in the range of 50% to 96% was achieved.

Published in:

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

Date of Conference:

16-18 April 2007