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Evaluation of Thermal Strains in BGA Packages Using Digital Speckle Correlation Technique and FEA

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4 Author(s)
Adam Robert Zbrzezny ; Advanced Micro Devices, Package Development Engineering, 105 Commerce Valley Drive West, Markham, Ontario, Canada, L3T 7W3. ; Vincent Chan ; Hua Lu ; Ming Zhou

A digital speckle correlation (DSC) technique was applied to second level interconnects of flip chip and wire bonded packages in order to measure in-situ deformations induced by temperature cycling. The measurements allowed for the total normal and shear strains to be evaluated at various temperatures for different package types having lead-free and Sn-Pb metallurgies. It was observed that among the flip chip packages the shear strains varied with temperature and were greater for the Sn-Pb package than for the lead-free package. As expected, the BGA package with a metal ring stiffener exhibited the lowest strains. The results from the FEA model of the wire bonded PBGA correlated well with the experimental data obtained by DSC.

Published in:

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

Date of Conference:

16-18 April 2007