By Topic

Evaluation of Thermal Strains in BGA Packages Using Digital Speckle Correlation Technique and FEA

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Zbrzezny, A.R. ; Adv. Micro Devices, Package Dev. Eng., Markham, ON ; Chan, V. ; Hua Lu ; Ming Zhou

A digital speckle correlation (DSC) technique was applied to second level interconnects of flip chip and wire bonded packages in order to measure in-situ deformations induced by temperature cycling. The measurements allowed for the total normal and shear strains to be evaluated at various temperatures for different package types having lead-free and Sn-Pb metallurgies. It was observed that among the flip chip packages the shear strains varied with temperature and were greater for the Sn-Pb package than for the lead-free package. As expected, the BGA package with a metal ring stiffener exhibited the lowest strains. The results from the FEA model of the wire bonded PBGA correlated well with the experimental data obtained by DSC.

Published in:

Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on

Date of Conference:

16-18 April 2007