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Evaluation of Thermal Strains in BGA Packages Using Digital Speckle Correlation Technique and FEA

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4 Author(s)
Zbrzezny, A.R. ; Adv. Micro Devices, Package Dev. Eng., Markham, ON ; Chan, V. ; Hua Lu ; Ming Zhou

A digital speckle correlation (DSC) technique was applied to second level interconnects of flip chip and wire bonded packages in order to measure in-situ deformations induced by temperature cycling. The measurements allowed for the total normal and shear strains to be evaluated at various temperatures for different package types having lead-free and Sn-Pb metallurgies. It was observed that among the flip chip packages the shear strains varied with temperature and were greater for the Sn-Pb package than for the lead-free package. As expected, the BGA package with a metal ring stiffener exhibited the lowest strains. The results from the FEA model of the wire bonded PBGA correlated well with the experimental data obtained by DSC.

Published in:
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on

Date of Conference: 16-18 April 2007

Page(s):
1 - 5
E-ISBN :
1-4244-1106-8
Print ISBN:
1-4244-1105-X
INSPEC Accession Number:
10285333
Conference Location :
London
Digital Object Identifier :
10.1109/ESIME.2007.359932
Product Type:
Conference Publications

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