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In this paper, a finite element modeling of lead and lead-free soldered PBGA package was performed. The inelastic stress and strain of the solder joints in the PBGA package under thermal cycling has been analyzed. The Garofalo-Arrheninus model was applied to describe the steady-state creep for the solders at high temperatures. The high-low temperatures extreme point, plastic strain, creep strain were analyzed in thermal cycling simulations. Various solder joint fatigue life was calculated by modified Coffin-Masson fatigue life prediction model. Finally, the fatigue life of three different solders in PBGA is compared
Published in:
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Date of Conference: 26-29 Aug. 2006
- Page(s):
- 1 - 5
- E-ISBN :
- 1-4244-0620-X
- Print ISBN:
- 1-4244-0619-6
- INSPEC Accession Number:
- 9486879
- Conference Location :
- Shanghai
- Digital Object Identifier :
- 10.1109/ICEPT.2006.359849
- Product Type:
- Conference Publications
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