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Study on the Board Level Reliability of Lead-free PBGA Packages

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4 Author(s)
Xuejing Kang ; Dept. of Mech. Eng., Guilin Univ. of Electron. Technol. ; Yujun Li ; Yang, D.G. ; Qin, L.C.

In this paper, a finite element modeling of lead and lead-free soldered PBGA package was performed. The inelastic stress and strain of the solder joints in the PBGA package under thermal cycling has been analyzed. The Garofalo-Arrheninus model was applied to describe the steady-state creep for the solders at high temperatures. The high-low temperatures extreme point, plastic strain, creep strain were analyzed in thermal cycling simulations. Various solder joint fatigue life was calculated by modified Coffin-Masson fatigue life prediction model. Finally, the fatigue life of three different solders in PBGA is compared

Published in:

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Date of Conference:

26-29 Aug. 2006

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