Build Up Material Effect on High Performance Flip Chip Ball Grid Array Package Reliability

In this paper, three different kinds of build up materials for high performance flip chip ball grid array packages were studied to understand material property of substrate build up layer effects on package reliability. Finite element analysis was first used to analysis the stress and thermal fatigue life of the package with different build up materials. Temperature cycle tests on both component level and board level were then performed to see differences in three different build up materials. Both simulation and experimental results reveal that reducing build up material CTE can improve package both component level and board level reliability. Build up material A has both better component level and board level reliability than build up material B and C. The experimental results also confirm that simulation can be used for new material development and evaluation