Close category search window
 

New Approach for Reducing DAD delay using Link Layer Assistance in Mobile IPv6

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)

There have been a lot of research and investigation to improve handover latency of mobile IPv6 (MIPv6). The handover latency is one of the most important factors because performance of TCP flows as well as realtime traffic degrades sharply as the latency increases. The MIPv6 handover process consists of movement detection, duplicate address detection (DAD), and binding update. Among the three components, DAD has been identified as the most critical factor. In this paper, we introduce novel schemes to reduce the DAD delay. By utilizing tentative address that an access router provides, a mobile node pre-determines its care-of-address before L2 handover such that the DAD period can be greatly reduced. We also devise a mechanism that reduces the messaging overhead via link layer assistances. Extensive performance analyses show that the proposed scheme significantly enhances the performance of MIPv6.

Published in:
Multimedia and Ubiquitous Engineering, 2007. MUE '07. International Conference on

Date of Conference: 26-28 April 2007

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.