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Fabrication of micromachined quartz-crystal resonators using surface activated bonding of silicon and quartz wafer

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4 Author(s)
Takahashi, A. ; Tohoku Univ., Sendai ; Ono, T. ; Yu-Ching Lin ; Esashi, M.

In this paper, we present the fabrication and the characterization of the cantilever-shaped quartz crystal resonator for high sensitive force sensing. Fabrication process employs low-temperature plasma-activated bonding of silicon to quartz wafer using N2 plasma. Fabricated resonator have thickness of 2~20 mum, fundamental resonant frequency of thickness-shear mode of 76-720 MHz. The 20-mum-thick cantilever exhibits a high quality factor of 5700.

Published in:

Sensors, 2006. 5th IEEE Conference on

Date of Conference:

22-25 Oct. 2006