Cart (Loading....) | Create Account
Close category search window

1.3-μm GaInAsP/InP transverse-mode stabilized buried-crescent lasers by a new fabrication technique using a reactive ion beam etching

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Kasukawa, A. ; Furakawa Electr. Co. Ltd., Yokohama, Japan ; Iwase, M. ; Matsumoto, N. ; Makino, T.
more authors

Transverse-mode-stabilized, 1.3-μm, GaInAsP/InP, buried-crescent (BC) lasers fabricated using a reactive ion beam etching (RIBE) technique are presented. Yields of single-transverse-mode operation as high as 95% are achieved with low threshold currents of 11-25 mA. Transverse-mode stability under both high-power and long-term operation (50°C, 20 mW, 1000 h) is demonstrated. A coupling efficiency into a single-mode fiber of 63% and a coupled power of 40 mW at 160 mA are achieved. Stable continuous-wave operation is also confirmed under a constant power of 5 mW (50 and 70°C) and 20 mW (50°C) in an aging test

Published in:

Lightwave Technology, Journal of  (Volume:7 ,  Issue: 12 )

Date of Publication:

Dec 1989

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.