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A new dimension of wireless sensor network architecture design is emerging where hundreds to thousands of ultra-light (<10 g) low-cost sensor nodes are required to collectively perform a spectrum of distributed remote sensing missions in hostile conditions, predominantly those encountered in space. Environmental extremes, such as mechanical, thermal, atmospheric, energetic, and dynamic must be considered. Research is underway to investigate the feasibility of fabricating survivable self-powered wireless sensor nodes monolithically with commercially available complementary metal-on-silicon technology. An example "SpaceChip" scenario is presented, where the conceptual design of a satellite-on-a-chip is explored.