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Power Semiconductor Equipment Cooling Methods and Application Criteria

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2 Author(s)
McLaughlin, Michael H. ; Research and Development Center, General Electric Company, Schenectady, N. Y. 12301. ; Vonzastrow, Etto E.

A variety of factors including cost effectiveness, output rating, and reliability influence the choice of cooling method for semiconductor power conversion equipment. For this study, a number of representative cooling systems (air, water, immersion) were evaluated for a 700 V ac to adjustable voltage dc conversion equipment. A transient thermal model of an external pressure-mounted double-side cooled thyristor (such as a Press Pak, Hockey Puk, Disk Pac, etc.) was used to demonstrate the transient time frame over which changes in the cooling system affect the system rating. The systems evaluated provided a range of system performance and demonstrated the need for careful definition of application requirements.

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Industry Applications, IEEE Transactions on  (Volume:IA-11 ,  Issue: 5 )