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Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist

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6 Author(s)
Kyounghwan Na ; School of Electrical Engineering and Computer Science, Seoul National University, Seoul, Korea. ; Ill hwan Kim ; Eunsung Lee ; Hyeon Cheol Kim
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For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, thickness of spacer and size and shape of pattern can be easy to control. This paper presents polymer bonding with thick, uniform and patterned spacing layer using SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and is cured at 95degC and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with 400 mum of thickness and 3.25% of uniformity through single coating. Also we performed silicon to glass bonding with thick, uniform and patterned spacing layer of SU-8 photoresist for wafer level package

Published in:

2006 International Conference on MEMS, NANO, and Smart Systems

Date of Conference:

Dec. 2006