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High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors

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7 Author(s)
Temple, D. ; RTI Int., Research Triangle Park, NC ; Bower, C.A. ; Malta, D. ; Robinson, J.E.
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The paper describes a platform technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator devices hybridized with Si electronics. Among these applications are high performance infrared focal plane array detectors

Published in:

Electron Devices Meeting, 2006. IEDM '06. International

Date of Conference:

11-13 Dec. 2006

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