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Current density and hot spot prediction using electrical-thermal co-simulation for multi-layer IC packages

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3 Author(s)
Lin Chee-Hoe ; Adv. Micro Devices (Singapore) Pte Ltd., Singapore ; Wong Wui-Weng ; Liu Bao-Min

Hot spot occurrence in integrated circuit (IC) packages is common nowadays as current density in the package increases. While electrical and thermal models are constructed to tackle the problem, however the models are loosely coupled between electrical and thermal phenomena. This paper derives an electrical-thermal co-simulation methodology that is validated by measurement on temperature distribution and hot spots in multi-layer IC packages.

Published in:

Electronics Packaging Technology Conference, 2006. EPTC '06. 8th

Date of Conference:

6-8 Dec. 2006

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