Cart (Loading....) | Create Account
Close category search window
 

Whisker formation behavior on tin film plated in high magnetic field

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)

High magnetic field was applied during Sn plating treatment for brass to change crystal orientation in the plating film. After prolonged heat treatment at 323 K, its effect on the formation of Sn whisker was investigated by scanning electron microscopic observations and X-ray diffraction (XRD). The XRD pattern of the film varied with the angle between the substrate and the direction of the magnetic field. When the specimen showed the XRD pattern similar to the film formed without the applied magnetic field, the whiskers were observed after the heat treatment. However, the generation of the whisker could not be confirmed in the case of the film with different XRD pattern. Therefore, it is expected that the plating treatment with the high magnetic field serves for inhibition of the whisker. The cases of Fe-42 mass% Ni alloy substrate were also discussed.

Published in:

Electronics Packaging Technology Conference, 2006. EPTC '06. 8th

Date of Conference:

6-8 Dec. 2006

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.