Cart (Loading....) | Create Account
Close category search window
 

An advanced data acquisition system for microprocessor package thermal characterization

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Tay, D. ; Adv. Micro Devices Pte Ltd, Singapore ; Liu Bao Min ; Mui, Y.C.

This paper describes the development of an advanced data acquisition test system for the thermal characterization of microprocessor packages. The system can power up multiple blocks at different rates, source and sense multi-thermal diodes, sense multiple thermal couples for the temperature measurement of the ambient air, peltier cold plate, heat sink base and etc. The data acquisition system consists of digital multimeters, source meter, power supplies, switching unit and specific boards. A LabVIEW program was developed to run the hardware as well as to capture the data. The calibration oven and the thermal test platform were upgraded with new test board fixture and connectors to interface with the advanced data acquisition test system. To solve the wiring issues caused by the multiple sensing, two-wire connection scheme for diode was validated and applied in the system. Advanced thermal characterization was performed with the thermal test vehicles under three typical power patterns with all the cells being sourced and sensed. The results revealed a more detailed thermal profile over the silicon die and such details will be helpful with thermal design and solutions for the microprocessor packages

Published in:

Electronics Packaging Technology Conference, 2006. EPTC '06. 8th

Date of Conference:

6-8 Dec. 2006

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.