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Epoxy adhesive and process enhancement on delamination related IC and packaging reliability problems: An evaluation study I

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6 Author(s)
Chang, S.T. ; Fairchild Semicond., Penang ; Loh, E.L. ; Khoo, E.C. ; Lim, S.F.
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The surface modification of bare Cu leadframe surfaces by heat treatment, or plasma cleaning, or the coupling of both treatments, either before die-attach, encapsulation, or before both processes, as a means to combat package reliability issue especially delamination of mode I & II were investigated. The effectiveness of these treatments were gauged with contact angle measurements: before, after and during post treatment ageing period of 24hrs. Prototype units were assembled and subjected to pre-condition of 85degC/85RH for 168hrs follow-up with 3 times reflow (peak temperature at 260degC for 20-40sec, MSLI). CSAM is used to interpret the performance of the epoxy adhesion on the pre-treated surfaces. The treatments were found to be effective in overcoming the delamination of mode I & II.

Published in:

Electronics Packaging Technology Conference, 2006. EPTC '06. 8th

Date of Conference:

6-8 Dec. 2006

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