Cart (Loading....) | Create Account
Close category search window

Epoxy adhesive and process enhancement on delamination related IC and packaging reliability problems: An evaluation study I

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Chang, S.T. ; Fairchild Semicond., Penang ; Loh, E.L. ; Khoo, E.C. ; Lim, S.F.
more authors

The surface modification of bare Cu leadframe surfaces by heat treatment, or plasma cleaning, or the coupling of both treatments, either before die-attach, encapsulation, or before both processes, as a means to combat package reliability issue especially delamination of mode I & II were investigated. The effectiveness of these treatments were gauged with contact angle measurements: before, after and during post treatment ageing period of 24hrs. Prototype units were assembled and subjected to pre-condition of 85degC/85RH for 168hrs follow-up with 3 times reflow (peak temperature at 260degC for 20-40sec, MSLI). CSAM is used to interpret the performance of the epoxy adhesion on the pre-treated surfaces. The treatments were found to be effective in overcoming the delamination of mode I & II.

Published in:

Electronics Packaging Technology Conference, 2006. EPTC '06. 8th

Date of Conference:

6-8 Dec. 2006

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.