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Coplanar Passive Circuits on Surface Micromachined Silicon and Thick Polymer Layers for Millimeter-wave Applications

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6 Author(s)
Bouchriha, F. ; LAAS-CNRS, 7. Avenue du Colonel Roche, 31077 Toulouse Cedex 4, France. Phone: +33-5-61-33-69-40, Fax: +33-5-61-33-69-69, E-mail: ; Grenier, K. ; Dubuc, D. ; Pons, P.
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In this paper, we report a novel technological issue for the realization of low loss coplanar passive circuits on low resistivity (LR-20 ¿.cm) silicon substrate using simultaneously a silicon surface micromachining in the slots and a thick polymer layer (BCB). The silicon etching into the coplanar slots leads indeed to a noticeable decrease of the losses, whereas filling the coplanar gaps with the low loss polymer minimizes the field interaction with the lossy silicon substrate and results in a much higher quality factor.

Published in:

Microwave Conference, 2003. 33rd European

Date of Conference:

Oct. 2003

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