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Dense Vertically Aligned Multiwalled Carbon Nanotube Arrays as Thermal Interface Materials

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6 Author(s)
Tao Tong ; Dept. of Mech. Eng., California Univ., Berkeley, CA ; Yang Zhao ; Lance Delzeit ; Ali Kashani
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Carbon nanotube (CNT) arrays are being considered as thermal interface materials (TIMs). Using a phase sensitive transient thermo-reflectance technique, we measure the thermal conductance of the two interfaces on each side of a vertically aligned CNT array as well as the CNT array itself. We show that the physically bonded interface by van der Waals adhesion has a conductance ~105W/m2K and is the dominant resistance. We also demonstrate that by bonding the free-end CNT tips to a target surface with the help of a thin layer of indium weld, the conductance can be increased to ~106W/m2K making it attractive as a TIM

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IEEE Transactions on Components and Packaging Technologies  (Volume:30 ,  Issue: 1 )