Cart (Loading....) | Create Account
Close category search window

Damage effects in Pyrex by CF4 reactive ion etching in dual RF-microwave plasmas

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)

The bonding disruption and thermal damage induced on Pyrex substrates during the reactive ion etching in CF4/Ar and CF 4/O2 dual RF-microwave plasmas is reported. Energy dispersive X-ray and scanning probe analyses indicate that metallic impurities aggregate in clusters of different atomic abundance. These clusters are shown to disrupt the homogeneity and contribute to a non-uniform etching of the substrates. The surface morphology, chemical composition and etching rate are shown to vary with the substrate impedance. Furthermore, the edge effects, local elemental composition, free radical permeation and extended exposure to microwave power are believed to induce substantial thermal damage

Published in:

Micro & Nano Letters, IET  (Volume:1 ,  Issue: 2 )

Date of Publication:

December 2006

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.