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Influence of 0-level packaging on the microwave performance of RF-MEMS devices

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4 Author(s)
Jourdain, A. ; IMEC vzw, Kapeldreef 75, B-3001 Leuven, Belgium. Tel: +32 16 288 220, Fax: +32 16 281 501, E-mail: jourdain@imec.be ; Brebels, S. ; De Raedt, W. ; Tilmans, H.A.C.

RF-MEMS devices (Radio Frequency-MicroElectroMechanical Systems) are made of moveable and fragile structures (membranes, beams, cantilevers,...) that must be encapsulated for protection and for stable performance characteristics. Zero-level or wafer-level packaging developed so far has been limited to dc-components. This paper elaborates on the design and fabrication of a 0-level package for housing RF-MEMS devices. The fabrication process is described and packages are characterized in terms of mechanical strength, hermeticity and microwave performance in the range 1-50 GHz. Simulations and experiments show minimal impact of the package on the RF losses if the cap has a minimal height of 50 ¿m, if low-loss materials (e.g., glass) are used, and if matched RF feedthroughs are implemented. Finally, in a multi-switch design, we recommend to minimize the number of feedthroughs, i.e. to use a single cap for the entire design.

Published in:

Microwave Conference, 2001. 31st European

Date of Conference:

24-26 Sept. 2001

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