By Topic

Hybrid Integration and Interconnect Design Platforms of Planar Circuit and Non-Radiative Dielectric (NRD) Guide for Millimeter-Wave Integrated Circuits and Systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Ke Wu ; Poly-Grames Research Center, Department of Electrical and Computer Engineering, C. P. 6079, Succ. Centre-Ville, Ecole Polytechnique, Montreal, Quebec, Canada H3C 3A7. E-mail:

This paper presents a class of hybrid integration techniques (HITs) of planar circuits and non-radiative dielectric (NRD) guide proposed for low-cost and high-performance millimeter-wave integrated circuits (ICs) and systems. Such platforms are in fact consistent with interconnect concepts of two dissimilar building blocks, which are developed on the basis of co-layered and multilayered arrangements of planar circuits and NRD-guide. Technical merits and design aspects of each integration scheme are discussed. Future research and development on this topic are also indicated with emphasis on a potential monolithic integration of the planar and non-planar geometries.

Published in:

Microwave Conference, 2000. 30th European

Date of Conference:

Oct. 2000