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This paper presents a class of hybrid integration techniques (HITs) of planar circuits and non-radiative dielectric (NRD) guide proposed for low-cost and high-performance millimeter-wave integrated circuits (ICs) and systems. Such platforms are in fact consistent with interconnect concepts of two dissimilar building blocks, which are developed on the basis of co-layered and multilayered arrangements of planar circuits and NRD-guide. Technical merits and design aspects of each integration scheme are discussed. Future research and development on this topic are also indicated with emphasis on a potential monolithic integration of the planar and non-planar geometries.