Close category search window
 

Circuit-Internal Characterization of MMICs using Two-Dimensional Electro-Optic Field Mapping in Combination with Microwave CAD Techniques

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
David, G. ; Gerhard-Mercator-Universität GH Duisburg, Sonderforschungsbereich 254; FG Optoelektronik, Kommandantenstraße 60, D-47048 Duisburg, Germany. Phone: +49-203-379-2346, Fax: +49-203-379-3400 ; Tempel, R. ; Ising, A. ; Kalayci, Y.
more authors

For the first time, distributions of microwave signals in an MMIC are measured by electro-optic field mapping techniques and compared with results of microwave CAD. In good agreement, the results show clear variations of the potential inside the MMIC. Moreover, the electro-optic measurement results reveal a pronounced nonlinear behaviour, of the circuit under saturation conditions. Thus, the combination of measurement and simulation provides the possibility of a circuit-intemal performance analysis of an MMIC. The results can be used as a basis for improvements of the design layout.

Published in:
Microwave Conference, 1994. 24th European  (Volume:2 )

Date of Conference: 5-9 Sept. 1994

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.