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Ultra-thin pocket embedding package for system in package

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5 Author(s)
Kim, K.-M. ; Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Yuseong-Gu Daejeon ; Sohn, B. ; Yook, J.M. ; Yeo, S.K.
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Proposed is a new type of packaging technology, `pocket embedding package', using selectively anodised aluminium substrate. In this technology, chips can be embedded inside aluminium substrate so that an ultra-thin and compact type of package can be achieved. A monolithic microwave integrated circuit dice with 120 mum thickness has been successfully embedded inside the substrate with a tolerance of less than 5 mum, and 300 mum of total thickness can be achieved with excellent thermal dissipation

Published in:

Electronics Letters  (Volume:43 ,  Issue: 6 )

Date of Publication:

March 15 2007

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