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Calculation of Three-Dimensional Passive Structures Including Bond-Wires, Via-Holes and Air-Bridges using the Spectral Domain Analysis Method

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2 Author(s)
Becks, T. ; Department of Electrical Engineering and Sonderforschungsbereich 254, Duisburg University, Bismarckstr. 81, D-4100 Duisburg, FRG ; Wolff, I.

A full-wave analysis method for the investigation of microstrip- and coplanar-structures including bond-wires, via-holes, gate-fingers and air-bridges is presented. For the first time spectral domain analysis technique is used to calculate the S-parameters of real three-dimensional metallization structures. The general formulation and the procedure of the method are described.

Published in:

Microwave Conference, 1991. 21st European  (Volume:1 )

Date of Conference:

9-12 Sept. 1991