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Corrections to "Enhancing the reliability of wafer level packaging by using solder joints layout design"

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3 Author(s)
Chang-Ming Liu ; Adv. Packaging Res. Center, Nat. Tsing Hua Univ., Hsinchu ; Chang-Chun Lee ; Kuo-Ning Chiang

In the original paper (see ibid., vol.29, no.4, p.877-85, Dec. 2006) the photographs of authors Chang-Ming Liu and Chang-Chun Lee were inadvertently switched in the biography section. The correct placement is shown here.

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:30 ,  Issue: 1 )