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Low Profile Integratable Inductor Fabricated Based on LTCC Technology for Microprocessor Power Delivery Applications

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3 Author(s)
Lim, M.H.F. ; Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA ; Zhenxian Liang ; van Wyk, J.D.

A novel low profile power inductor suitable for planar integration is designed and fabricated based on low temperature co-fired ceramics technology for microprocessor power delivery applications. The inductor was designed to operate at a switching frequency of 4 to 5MHz, carrying a nominal dc current of 20A with a ripple current of 8 to 10A in a 5-V to 1-V dc-dc converter. The design and fabrication procedure is discussed in this paper, followed by small signal measurement and magnetic characterization results. The inductor was implemented in a prototype converter and the large signal measurement results are presented and its performance evaluated

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:30 ,  Issue: 1 )

Date of Publication:

March 2007

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