Cart (Loading....) | Create Account
Close category search window
 

Low Profile Integratable Inductor Fabricated Based on LTCC Technology for Microprocessor Power Delivery Applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Lim, M.H.F. ; Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA ; Zhenxian Liang ; van Wyk, J.D.

A novel low profile power inductor suitable for planar integration is designed and fabricated based on low temperature co-fired ceramics technology for microprocessor power delivery applications. The inductor was designed to operate at a switching frequency of 4 to 5MHz, carrying a nominal dc current of 20A with a ripple current of 8 to 10A in a 5-V to 1-V dc-dc converter. The design and fabrication procedure is discussed in this paper, followed by small signal measurement and magnetic characterization results. The inductor was implemented in a prototype converter and the large signal measurement results are presented and its performance evaluated

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:30 ,  Issue: 1 )

Date of Publication:

March 2007

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.