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MiMAC - A New Multilayer Thin Film Microwave Component Technology

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1 Author(s)
Redfern, S.W. ; Marconi Electronic Devices Limited, Doddington Road, Lincoln LN6.3LF

A new integrated thin film process is described which permits the inclusion of passive circuit elements at the substrate fabrication stage. Microwave Monolithic Alumina Circuits (MiMAC) offer cost and performance advantages over conventional chip and wire hybrids. Details of this process are presented, together with results for a MiMAC amplifier design which shows improved performance over it's conventional hybrid equivalent.

Published in:

Microwave Conference, 1988. 18th European

Date of Conference:

12-15 Sept. 1988