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Optical Transceiver Chips Based on Co-Integration of Capacitively Coupled Proximity Interconnects and VCSELs

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7 Author(s)
Xuezhe Zheng ; Sun Microsystems Inc, San Diego, CA ; Lexau, J.K. ; Bergey, J. ; Cunningham, J.E.
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Combining the strengths of both proximity communication and optical communication, a new hybrid input-output (I/O) platform delivers on-chip bandwidth off-chip and over distance. We demonstrate, for the first time, a four-channel hybrid I/O interface by integrating proximity communication and vertical-cavity surface-emitting-laser-based parallel optical interconnects on the same commercial 90-nm complementary metal-oxide-semiconductor platform. The optical I/O can operate at 5 Gb/s per channel, and the complete hybrid I/O interface achieved 2.5 Gb/s per channel. We characterize the I/O link performance for various data rates and chip separations, and show 10-mum chip separation tolerance for proximity communication

Published in:

Photonics Technology Letters, IEEE  (Volume:19 ,  Issue: 7 )