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Selective Solid-Phase Silicon Epitaxy of p+ Aluminum-Doped Contacts for Nanoscale Devices

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3 Author(s)
Civale, Y. ; Delft Inst. for Micro Electron. & Submicron Technol., Delft Univ. of Technol. ; Nanver, L.K. ; Schellevis, H.

A solid-phase epitaxy (SPE) process based on material inversion of an amorphous silicon (alpha-Si) on aluminum layer-stack is applied to form ultrashallow p-type junctions. In this paper, we demonstrate the controllability of the whole process when the junction area is reduced to the sub-100-nm range and the processing temperature is reduced to 400 degC. The SPE-Si to Si-substrate interface, analyzed locally by transmission electron microscopy and more systematically by the fabrication and electrical characterization of p+-n diodes, was found to be practically defect-free. Moreover, it is demonstrated by capacitance-voltage profiling that the Al-dopants do not diffuse into the bulk silicon for the used processing temperatures and the SPE p+-island to n-substrate transition is ideally abrupt. The I-V characteristics of the as-fabricated p+-n diodes are near ideal (n=1.03) and low-ohmic contact resistance to p- and p + regions is reliably obtained

Published in:

Nanotechnology, IEEE Transactions on  (Volume:6 ,  Issue: 2 )

Date of Publication:

March 2007

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