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High Accuracy Disbond Thickness Estimation Scheme Employing Multiple-Frequency Near-Field Microwave Measurements

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2 Author(s)
M. A. Abou-Khousa ; Applied Microwave Nondestructive Testing Laboratory (amntl), Electrical and Computer Engineering Department, University of Missouri-Rolla, Rolla, Missouri 65409. Tel: 1 (573) 341-4728, Fax: 1 (573) 341-4532 ; R. Zoughi

Microwave nondestructive evaluation (NDE) techniques have shown great potential for disbond detection in multi-layer dielectric structures. However, a quantitative disbond thickness estimation scheme has not been introduced yet. In this paper, we propose a maximum-likelihood (ML) disbond thickness estimation scheme utilizing multiple independent measurements obtained at different frequencies. By simulations and experiments, we show that the proposed scheme produces highly accurate disbond thickness estimates

Published in:

2006 IEEE Instrumentation and Measurement Technology Conference Proceedings

Date of Conference:

24-27 April 2006