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Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders

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7 Author(s)
Jang, Jin-Wook ; Freescale Semicond., Inc, Tempe, AZ ; De Silva, A.P. ; Drye, J.E. ; Post, S.L.
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High strain-rate drop impact tests were performed on ball grid array (BGA) packages with solder compositions of (in wt%) Sn-3.8Ag-0.7Cu (SnAgCu) and eutectic Sn-37Pb (SnPb). Solder balls were joined to the metallizations of plated Ni on the device side and plated Cu on the board side. The BGA packages were tested at 1500 g within 0.5 ms, resulting in an imposed bending strain of 0.2-0.3%. Both SnAgCu and SnPb joints failed at the interface at the device side but the detailed failure morphology differed significantly. The crack location for the eutectic SnPb was primarily through the solder and seldom extended through an entire bump. The SnPb joints also exhibited bulk solder deformation. The SnAgCu joints showed extremely brittle behavior with an interfacial failure at the (Ni,Cu)3Sn4 intermetallics/Ni under bump metallization (UBM) interface. The strain rate sensitivity of bulk solder defines the drop test performance and the eutectic SnPb solder showed better drop impact performance due to a less strain rate sensitivity

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Electronics Packaging Manufacturing, IEEE Transactions on  (Volume:30 ,  Issue: 1 )