Referenced Items are not available for this document.
A schematic-electromagnetic (EM) hybrid optimization scheme was used to design an integrated passive device (IPD)-diplexer. The method uses component values derived from circuit simulation and optimization to determine physical design changes. The diplexer was fabricated in a silicon wafer process. The small form-factor (2.6 times 1.3 times 0.25 mm3) of this device makes it very attractive for system in package (SiP) applications. Simulated and measured results show good agreement
Published in:
Electrical Performance of Electronic Packaging, 2006 IEEE
Date of Conference: Oct. 2006
- Page(s):
- 327 - 330
- Print ISBN:
- 1-4244-0668-4
- INSPEC Accession Number:
- 9253391
- Conference Location :
- Scottsdale, AZ
- Digital Object Identifier :
- 10.1109/EPEP.2006.321244
- Product Type:
- Conference Publications
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