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Analytical Estimation of Interconnect Loss Due to Dummy Fills

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2 Author(s)
Tsuchiya, A. ; Dept. of Commun. & Comput. Eng., Kyoto Univ. ; Onodera, Hidetoshi

This paper proposes an analytical method to estimate the interconnect loss due to dummy fills. By modeling the eddy current in dummy fills as a simple square loop, the authors derive the impact of dummy fills on the loss of interconnect. The authors verified the proposed method by a 3D field solver. Experimental results show that the proposed method provides accurate modeling of the effect of dummy fills

Published in:

Electrical Performance of Electronic Packaging, 2006 IEEE

Date of Conference:

Oct. 2006