Referenced Items are not available for this document.
This paper proposes an analytical method to estimate the interconnect loss due to dummy fills. By modeling the eddy current in dummy fills as a simple square loop, the authors derive the impact of dummy fills on the loss of interconnect. The authors verified the proposed method by a 3D field solver. Experimental results show that the proposed method provides accurate modeling of the effect of dummy fills
Published in:
Electrical Performance of Electronic Packaging, 2006 IEEE
Date of Conference: Oct. 2006
- Page(s):
- 149 - 152
- Print ISBN:
- 1-4244-0668-4
- INSPEC Accession Number:
- 9253350
- Conference Location :
- Scottsdale, AZ
- Digital Object Identifier :
- 10.1109/EPEP.2006.321214
- Product Type:
- Conference Publications
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